计算机术语完全介绍

      网络记忆 2004-9-17 12:57
1、CPU
3DNow!(3D no waiting)
ALU(Arithmetic Logic Unit,算术逻辑单元)
Aluminum(铝)
AGU(Address Generation Units,地址产成单元)
APS(Alternate Phase Shifting,交替相位跳转)
ASB(Advanced System Buffering,高级系统缓冲)
ATC(Advanced Transfer Cache,高级转移缓存)
BGA(Ball Grid Array,球状矩阵排列)
BHT(branch prediction table,分支预测表)
Bops(Billion Operations Per Second,10亿操作/秒)
BPU(Branch Processing Unit,分支处理单元)
Brach Pediction(分支预测)
CBGA (Ceramic Ball Grid Array,陶瓷球状矩阵排列)
CDIP (Ceramic Dual-In-Line,陶瓷双重直线)
CMOS(Complementary Metal Oxide Semiconductor,互补金属氧化物半导体)
CISC(Complex Instruction Set Computing,复杂指令集计算机)
CLK(Clock Cycle,时钟周期)
COB(Cache on board,板上集成缓存,做在CPU卡上的二级缓存,通常是内核的一半速度))
COD(Cache on Die,芯片内集成缓存,即内核集成全速二级缓存,又称片内cache)
Copper(铜)
CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
CPU(Center Processing Unit,中央处理器)
CSP(Chip Scale Package,芯片比例封装)
CXT(Chooper eXTend,增强形K6-2内核,即K6-3)
Data Forwarding(数据前送)
DCLK(Dot Clock,点时钟)
DDT(Dynamic Deferred Transaction,动态延期处理)
Decode(指令解码)
DIB(Dual Independent Bus,双重独立总线)
EBGA(Enhanced Ball Grid Array,增强形球状矩阵排列)
EC(Embedded Controller,嵌入式控制器)
Embedded Chips(嵌入式)
EPM(Enhanced Power Management,增强形能源管理)
EPIC(explicitly parallel instruction code,并行指令代码)
FADD(Floationg Point Addition,浮点加)
FBGA (Fine-Pitch Ball Grid Array,精细倾斜球状矩阵排列)
FC-PGA(Flip-Chip Pin Grid Array,反转芯片针脚栅格阵列)
FDIV(Floationg Point Divide,浮点除)
FEMMS:Fast Entry/Exit Multimedia State,快速进入/退出多媒体状态
FFT(fast Fourier transform,快速热欧姆转换)
FID(FID:Frequency identify,频率鉴别号码)
FIFO(First Input First Output,先入先出队列)
flip-chip(芯片反转)
FLOPs(Floating Point Operations Per Second,浮点操作/秒)
FMUL(Floationg Point Multiplication,浮点乘)
FPRs(floating-point registers,浮点寄存器)
FPU(Float Point Unit,浮点运算单元)
FSUB(Floationg Point Subtraction,浮点减)
GFD(Gold finger Device,金手指超频设备)
GTL(Gunning Transceiver Logic,射电收发逻辑电路)
GVPP(Generic Visual Perception Processor,常规视觉处理器)
HL-PBGA: 表面黏著,高耐热、轻薄型塑胶球状矩阵封装
IA(Intel Architecture,英特尔架构)
ICU(Instruction Control Unit,指令控制单元)
ID(identify,鉴别号码)
IDF(Intel Developer Forum,英特尔开发者论坛)
IEU(Integer Execution Units,整数执行单元)
ILP(Instruction Level Parallelism,指令级平行运算)
IMM: Intel Mobile Module, 英特尔移动模块
Instructions Cache,指令缓存
Instruction Coloring(指令分类)
IOPs(Integer Operations Per Second,整数操作/秒)
IPC(Instructions Per Clock Cycle,指令/时钟周期)
ISA(instruction set architecture,指令集架构)
ITC(Instruction Trace Cache,指令追踪缓存)
KNI(Katmai New Instructions,Katmai新指令集,即SSE)
Latency(潜伏期)
LDT(Lightning Data Transport,闪电数据传输总线)
LFU(Legacy Function Unit,传统功能单元)
Local Interconnect(局域互连)
MAC(multiply-accumulate,累积乘法)
mBGA (Micro Ball Grid Array,微型球状矩阵排列)
MESI(Modified, Exclusive, Shared, Invalid:修改、排除、共享、废弃)
MMX(MultiMedia Extensions,多媒体扩展指令集)
MMU(Multimedia Unit,多媒体单元)
MMU(Memory Management Unit,内存管理单元)
MFLOPS(Million Floationg Point/Second,每秒百万个浮点操作)
MHz(Million Hertz,兆赫兹)
Mops(Million Operations Per Second,百万次操作/秒)
MP(Multi-Processing,多重处理器架构)
MPU(Microprocessor Unit,微处理器)
MPS(MultiProcessor Specification,多重处理器规范)
MSRs(Model-Specific Registers,特别模块寄存器)
NAOC(no-account OverClock,无效超频)
NI(Non-Intel,非英特尔)
NOP(no operation,非操作指令)
OCPL(Off Center Parting Line,远离中心部分线队列)
OLGA(Organic Land Grid Array,基板栅格阵列)
OoO(Out of Order,乱序执行)
OPC(Optical Proximity Correction,光学临近修正)
OPN(ordering part numbers,顺序部份记数)
PBGA(Plastic Pin Ball Grid Array,塑胶球状矩阵排列)
PDIP (Plastic Dual-In-Line,塑料双重直线)
PDP(Parallel Data Processing,并行数据处理)
PGA(Pin-Grid Array,引脚网格阵列),耗电大
PLCC (Plastic Leaded Chip Carriers,塑料行间芯片运载)
Post-RISC
PR(Performance Rate,性能比率)
PSN(Processor Serial numbers,处理器序列号)
PIB(Processor In a Box,盒装处理器)
PPGA(Plastic Pin Grid Array,塑胶针状矩阵封装)
PQFP(Plastic Quad Flat Package,塑料方块平面封装)
QFP(Quad Flat Package,方块平面封装)
QSPS(Quick Start Power State,快速启动能源状态)
RAW(Read after Write,写后读)
Register Contention(抢占寄存器)
Register Pressure(寄存器不足)
Register Renaming(寄存器重命名)
Remark(芯片频率重标识)
Resource contention(资源冲突)
Retirement(指令引退)
RISC(Reduced Instruction Set Computing,精简指令集计算机)
ROB(Re-Order Buffer,重排序缓冲区)
SC242(242-contact slot connector,242脚金手指插槽连接器)
SEC(Single Edge Connector,单边连接器)
SECC(Single Edge Contact Cartridge,单边接触卡盒)
SEPP(Single Edge Processor Package,单边处理器封装)
Shallow-trench isolation(浅槽隔离)
SIMD(Single Instruction Multiple Data,单指令多数据流)
SiO2F(Fluorided Silicon Oxide,二氧氟化硅)
SMI(System Management Interrupt,系统管理中断)
SMM(System Management Mode,系统管理模式)
SMP(Symmetric Multi-Processing,对称式多重处理架构)
SMT(Simultaneous multithreading,同步多线程)
SOI: Silicon-on-insulator,绝缘体硅片
SOIC (Plastic Small Outline,塑料小型)
SONC(System on a chip,系统集成芯片)
SPGA(Staggered Pin Grid Array、交错式针状矩阵封装)
SPEC(System Performance Evaluation Corporation,系统性能评估测试)
SQRT(Square Root Calculations,平方根计算)
SSE(Streaming SIMD Extensions,单一指令多数据流扩展)
SSOP (Shrink Plastic Small Outline,缩短塑料小型)
Superscalar(超标量体系结构)
TAP(Test Access Port,测试存取端口)
TBGA(Tie Ball Grid Array,带状球形光栅阵列)
TCP: Tape Carrier Package(薄膜封装),发热小
Throughput(吞吐量)
TLB(Translate Look side Buffers,翻译旁视缓冲器)
TLP(Thread-Level Parallelism,线程级并行)
TQFP (Thin Plastic Quad Flat Pack,薄型方面平面封装)
TSOP (Thin Small Outline Plastic,薄型小型塑料)
USWC(Uncacheabled Speculative Write Combination,无缓冲随机联合写操作)
VALU(Vector Arithmetic Logic Unit,向量算术逻辑单元)
VID(VID:Voltage identify,电压鉴别号码)
VLIW(Very Long Instruction Word,超长指令字)
VPU(Vector Permutate Unit,向量排列单元)
VPU(vector processing units,向量处理单元,即处理MMX、SSE等SIMD指令的地方)
VSA(Virtual System Architecture,虚拟系统架构)

2、主板
ACR(Advanced Communications Riser,高级通讯升级卡)
ADIMM(advanced Dual In-line Memory Modules,高级双重内嵌式内存模块)
AGTL+(Assisted Gunning Transceiver Logic,援助发射接收逻辑电路)
AIMM(AGP Inline Memory Module,AGP板上内存升级模块)
AMR(Audio/Modem Riser;音效/调制解调器主机板附加直立插卡)
AHA(Accelerated Hub Architecture,加速中心架构)
ASK IR(Amplitude Shift Keyed Infra-Red,长波形可移动输入红外线)
AT(Advanced Technology,先进技术)
ATX(AT Extend,扩展型AT)
BIOS(Basic Input/Output System,基本输入/输出系统)
CNR(Communication and Networking Riser,通讯和网络升级卡)
CSE(Configuration Space Enable,可分配空间)
COAST(Cache-on-a-stick,条状缓存)
DB: Device Bay,设备插架
DMI(Desktop Management Interface,桌面管理接口)
DRCG(Direct Rambus clock generator,直接RAMBUS时钟发生器)
DVMT(Dynamic Video Memory Technology,动态视频内存技术)
EB(Expansion Bus,扩展总线)
EISA(Enhanced Industry Standard Architecture,增强形工业标准架构)
EMI(Electromagnetic Interference,电磁干扰)
ESCD(Extended System Configuration Data,可扩展系统配置数据)
FBC(Frame Buffer Cache,帧缓冲缓存)
FireWire(火线,即IEEE1394标准)
FlexATX(Flexibility ATX,可扩展性ATX)
FSB(Front Side Bus,前置总线,即外部总线)
FWH( Firmware Hub,固件中心)
GMCH(Graphics & Memory Controller Hub,图形和内存控制中心)
GPA(Graphics Performance Accelerator,图形性能加速卡)
GPIs(General Purpose Inputs,普通操作输入)
GTL+(Gunning Transceiver Logic,发射接收逻辑电路)
HDIT(High Bandwidth Differential Interconnect Technology,高带宽微分互连技术)
IC(integrate circuit,集成电路)
ICH(Input/Output Controller Hub,输入/输出控制中心)
IHA(Intel Hub Architecture,英特尔Hub架构)
INTIN(Interrupt Inputs,中断输入)
IR(infrared ray,红外线)
IrDA(infrared ray,红外线通信接口,可进行局域网存取和文件共享)
ISA(Industry Standard Architecture,工业标准架构)
ISA(instruction set architecture,工业设置架构)
LPC(Low Pin Count,少针脚型接口)
MC(Memory Controller,内存控制器)
MCA(Micro Channel Architecture,微通道架构)
MCH(Memory Controller Hub,内存控制中心)
MDC(Mobile Daughter Card,移动式子卡)
MII(Media Independent Interface,媒体独立接口)
MRH-R(Memory Repeater Hub,内存数据处理中心)
MRH-S(SDRAM Repeater Hub,SDRAM数据处理中心)
MT=MegaTransfers(兆传输率)
MTH(Memory Transfer Hub,内存转换中心)
NGIO(Next Generation Input/Output,新一代输入/输出标准)
OHCI(Open Host Controller Interface,开放式主控制器接口)
P64H(64-bit PCI Controller Hub,64位PCI控制中心)
PCB(printed circuit board,印刷电路板)
PCBA(Printed Circuit Board Assembly,印刷电路板装配)
PCI(Peripheral Component Interconnect,互连外围设备)
PCI SIG(Peripheral Component Interconnect Special Interest Group,互连外围设备专业组)
RE(Read Enable,可读取)
POST(Power On Self Test,加电自测试)
RBB(Rapid BIOS Boot,快速BIOS启动)
RNG(Random number Generator,随机数字发生器)
RTC(Real Time Clock,实时时钟)
KBC(KeyBroad Control,键盘控制器)
SAP(Sideband Address Port,边带寻址端口)
SBA(Side Band Addressing,边带寻址)
SCK (CMOS clock,CMOS时钟)
SFF(Small Form Factor,小型接口)
SMA(Share Memory Architecture,共享内存结构)
STD(Suspend To Disk,磁盘唤醒)
STR(Suspend To RAM,内存唤醒)
SVR: Switching Voltage Regulator(交换式电压调节)
USB(Universal Serial Bus,通用串行总线)
USDM(Unified System Diagnostic Manager,统一系统监测管理器)
VID(Voltage Identification Definition,电压识别认证)
VLB(Video Electronics Standards Association Local Bus,视频电子标准协会局域总线)
VLSI(Very Large Scale Integration,超大规模集成电路)
VSB(V Standby,待命电压)
VRM(Voltage Regulator Module,电压调整模块)
WE(Write Enalbe,可写入)
XT(Extended Technology,扩充技术)
ZIF(Zero Insertion Force, 零插力插座)

芯片组
ACPI(Advanced Configuration and Power Interface,先进设置和电源管理)
AGP(Accelerated Graphics Port,图形加速接口)
I/O(Input/Output,输入/输出)
MIOC: Memory and I/O Bridge Controller,内存和I/O桥控制器
NBC: North Bridge Chip(北桥芯片)
PIIX: PCI ISA/IDE Accelerator(加速器)
PSE36: Page Size Extension 36-bit,36位页面尺寸扩展模式
PXB: PCI Expander Bridge,PCI增强桥
RCG: RAS/CAS Generator,RAS/CAS发生器
SBC: South Bridge Chip(南桥芯片)
SMB(System Management Bus,全系统管理总线)
SPD(Serial Presence Detect,连续存在检测装置)
SSB: Super South Bridge,超级南桥芯片
TDP: Triton Data Path(数据路径)
TSC: Triton System Controller(系统控制器)
QPA: Quad Port Acceleration(四接口加速)

主板技术
Gigabyte
ACOPS: Automatic CPU OverHeat Prevention System(CPU过热预防系统)
SIV: System Information Viewer(系统信息观察)
磐英
ESDJ(Easy Setting Dual Jumper,简化CPU双重跳线法)
浩鑫
UPT(USB、PANEL、LINK、TV-OUT四重接口)

3、显示设备
AD(Analog to Digitalg,模拟到数字转换)
ASIC(Application Specific Integrated Circuit,特殊应用积体电路)
ASC(Auto-Sizing and Centering,自动调效屏幕尺寸和中心位置)
ASC(Anti Static Coatings,防静电涂层)
AGC(Anti Glare Coatings,防眩光涂层)
Aperture Grills(栅条式金属板)
ARC(Anti Reflect Coating,防反射涂层)
BLA: Bearn Landing Area(电子束落区)
BMC(Black Matrix Screen,超黑矩阵屏幕)
cd/m^2(candela/平方米,亮度的单位)
CRC(Cyclical Redundancy Check,循环冗余检查)
CRT(Cathode Ray Tube,阴极射线管)
CVS(Compute Visual Syndrome,计算机视觉综合症)
DA(Digital to Analog,数字到模拟转换)
DDC(Display Data Channel,显示数据通道)
DDWG(Digital Display Working Group,数字化显示工作组)
DEC(Direct Etching Coatings,表面蚀刻涂层)
Deflection Coil(偏转线圈)
DFL(Dynamic Focus Lens,动态聚焦)
DFP(Digital Flat Panel,数字平面显示标准)
DFPG(Digital Flat Panel Group,数字平面显示标准工作组)
DFS(Digital Flex Scan,数字伸缩扫描)
DIC: Digital Image Control(数字图像控制)
Digital Multiscan II(数字式智能多频追踪)
DLP(digital Light Processing,数字光处理)
DOSD: Digital On Screen Display(同屏数字化显示)
DPMS(Display Power Management Signalling,显示能源管理信号)
Dot Pitch(点距)
DQL(Dynamic Quadrapole Lens,动态四极镜)
DSP(Digital Signal Processing,数字信号处理)
DSTN(Double layers Super Twisted Nematic,双层超扭曲向列,无源矩阵LCD)
DTV(Digital TV,数字电视)
DVI(Digital Visual Interface,数字化视像接口)
EFEAL(Extended Field Elliptical Aperture Lens,可扩展扫描椭圆孔镜头)
FED(Field Emission Displays,电场显示器)
Flyback Transformer(回转变压器)
FPD(flat panel display,平面显示器)
FRC: Frame Rate Control(帧比率控制)
HDTV(high definition television,高清晰度电视)
HVD(High Voltage Differential,高分差动)
INVAR(不胀铜)
IPS(in-plane switching,平面开关)
LCD(liquid crystal display,液晶显示屏)
LCOS: Liquid Crystal On Silicon(硅上液晶)
LED(light emitting diode,光学二级管)
L-SAGIC(Low Power-Small Aperture G1 wiht Impregnated Cathode,低电压光圈阴极管)
LVD(Low Voltage Differential,低分差动)
LVDS(Low Voltage Differential Signal,低分差动信号)
LTPS(Low Temperature Polysilicon,低温多硅显示器)
MALS(Multi Astigmatism Lens System,多重散光聚焦系统)
MDA(Monochrome Adapter,单色设备)
Monochrome Monitor(单色显示器)
MS: Magnetic Sensors(磁场感应器)
MVA(multi-domain vertical alignment,广域垂直液晶队列)
OSD(On Screen Display,同屏显示)
P&D(Plug and Display,即插即显)
PDP(plasma display,等离子显示器)
Porous Tungsten(活性钨)
RGB(Red、Blue、Green,红、蓝、绿三原色)
ROP(raster operations,光栅操作)
RSDS: Reduced Swing Differential Signal(小幅度摆动差动信号)
SC(Screen Coatings,屏幕涂层)
Single Ended(单终结)
Shadow Mask(点状阴罩)
SXGA(Super eXtended Graphics Array,超级扩展型图形阵列)
STN(Super Twisted Nematic,超扭曲向列,无源矩阵)
TCO(The Swedish Confederation of Professional Employees,瑞典专业工作人员联合会)
TDT(Timeing Detection Table,数据测定表)
TMDS(Transition Minimized Differential Signaling,转换极低损耗微分信号)
TN(Twisted Nematic,扭曲液晶向列,无源矩阵LCD)
TN+film(twisted nematic and retardation film,扭曲液晶向列+延迟薄膜)
TICRG: Tungsten Impregnated Cathode Ray Gun(钨传输阴级射线枪)
TFT(thin film transistor,薄膜晶体管,有源矩阵LCD)
Trinitron(特丽珑)
UCC(Ultra Clear Coatings,超清晰涂层)
VAGP: Variable Aperature Grille Pitch(可变间距光栅)
VBI: Vertical Blanking Interval(垂直空白间隙)
VESA(Video Electronics Standards Association,视频电子标准协会)
VGA(video graphics array,视频图像阵列)
VDT(Video Display Terminals,视频显示终端)
VRR: Vertical Refresh Rate(垂直扫描频率)
XGA(eXtended Graphics Array,扩展型图形阵列)
YUV(亮度和色差信号)

4、视频
3D:Three Dimensional,三维
3DCG(3D computer graphics,三维计算机图形)
3DS(3D SubSystem,三维子系统)
A-Buffer(Accumulation Buffer,积聚缓冲)
ADC(Analog to Digital Converter,模数传换器)
AE(Atmospheric Effects,雾化效果)
AFR(Alternate Frame Rendering,交替渲染技术)
Anisotropic Filtering(各向异性过滤)
APPE(Advanced Packet Parsing Engine,增强形帧解析引擎)
AV(Analog Video,模拟视频)
AV(Audio & Video,音频和视频)
BAC(Bad Angle Case,边角损坏采样)
Back Buffer,后置缓冲
Backface culling(隐面消除)
Battle for Eyeballs(眼球大战,各3D图形芯片公司为了争夺用户而作的竞争)
Bilinear Filtering(双线性过滤)
CEA(Critical Edge Angles,临界边角)
CEM(cube environment mapping,立方环境映射)
CG(Computer Graphics,计算机生成图像)
Clipping(剪贴纹理)
Clock Synthesizer,时钟合成器
compressed textures(压缩纹理)
Concurrent Command Engine,协作命令引擎
Center Processing Unit Utilization,中央处理器占用率
DAC(Digital to Analog Converter,数模传换器)
DCT(Display Compression Technology,显示压缩技术)
DDS(Direct Draw Surface,直接绘画表面)
Decal(印花法,用于生成一些半透明效果,如:鲜血飞溅的场面)
DFP(Digital Flat Panel,数字式平面显示器)
DFS: Dynamic Flat Shading(动态平面描影),可用作加速
Dithering(抖动)
Directional Light,方向性光源
DME: Direct Memory Execute(直接内存执行)
DOF(Depth of Field,多重境深)
dot texture blending(点型纹理混和)
Double Buffering(双缓冲区)
DIR(Direct Rendering Infrastructure,基层直接渲染)
DVI(Digital Video Interface,数字视频接口)
DxR: DynamicXTended Resolution(动态可扩展分辨率)
DXTC(Direct X Texture Compress,DirectX纹理压缩,以S3TC为基础)
Dynamic Z-buffering(动态Z轴缓冲区),显示物体远近,可用作远景
E-DDC(Enhanced Display Data Channel,增强形视频数据通道协议,定义了显示输出与主系统之间的通讯通道,能提高显示输出的画面质量)
Edge Anti-aliasing(边缘抗锯齿失真)
E-EDID(Enhanced Extended Identification Data,增强形扩充身份辨识数据,定义了电脑通讯视频主系统的数据格式)
Execute Buffers,执行缓冲区
environment mapped bump mapping(环境凹凸映射)
Extended Burst Transactions,增强式突发处理
Fast Write(AGP总线快写功能)
Front Buffer,前置缓冲
Flat(平面描影)
Frames rate is King(帧数为王)
FSAA(Full Scene/Screen Anti-aliasing,全景/屏幕抗锯齿)
Fog(雾化效果)
flip double buffered(反转双缓存)
fog table quality(雾化表画质)
FRJS(Fully Random Jittered Super-Sampling,完全随机移动式超级采样)
GART(Graphic Address Remappng Table,图形地址重绘表)
Gouraud Shading,高洛德描影,也称为内插法均匀涂色
GPU(Graphics Processing Unit,图形处理器)
GTF(Generalized Timing Formula,一般程序时间,定义了产生画面所需要的时间,包括了诸如画面刷新率等)
GTS(Giga Textel Sharder,十亿像素填充率)
HAL(Hardware Abstraction Layer,硬件抽像化层)
hardware motion compensation(硬件运动补偿)
HEL: Hardware Emulation Layer(硬件模拟层)
high triangle count(复杂三角形计数)
HSR(Hidden Surface Removal,隐藏表面移除)
HTP(Hyper Texel Pipeline,超级像素管道)
ICD(Installable Client Driver,可安装客户端驱动程序)
IDCT(Inverse Discrete Cosine Transform,非连续反余弦变换,GeForce的DVD硬件强化技术)
Immediate Mode,直接模式
IPPR: Image Processing and Pattern Recognition(图像处理和模式识别)
JGSS(Jittered Grid Super-Sampling,移动式栅格超级采样)
large textures(大型纹理)
LF(Linear Filtering,线性过滤,即双线性过滤)
LFB(Linear Frame-Buffer,线性帧缓冲)
lighting(光源)
lightmap(光线映射)
Local Peripheral Bus(局域边缘总线)
LOD(Levels-of-Detail,细节级)
mipmapping(MIP映射)
MAC(Mediocre Angle Case,普通角采样)
Modulate(调制混合)
Motion Compensation,动态补偿
motion blur(模糊移动)
MPPS:Million Pixels Per Second,百万个像素/秒
Multi-Resolution Mesh,多重分辨率组合
Multi Threaded Bus Master,多重主控
Multitexture(多重纹理)
nerest Mipmap(邻近MIP映射,又叫点采样技术)
NSR(nVidia Shading Rasterizer,nVidia描影光栅引擎)
OGSS(Ordered Grid Super-Sampling,顺序栅格超级采样)
Overdraw(透支,全景渲染造成的浪费)
partial texture downloads(并行纹理传输)
Parallel Processing Perspective Engine(平行透视处理器)
Perspective Correction(透视纠正)
PGC(Parallel Graphics Configuration,并行图像设置)
pixel(Picture element,图像元素,又称P像素,屏幕上的像素点)
point light(一般点光源)
point sampling(点采样技术,又叫邻近MIP映射)
Precise Pixel Interpolation,精确像素插值
Procedural textures(可编程纹理)
PTC(Palletized Texture Compression,并行纹理压缩)
QDR(Quad Data Rate,四倍速率)
RAMDAC(Random Access Memory Digital to Analog Converter,随机存储器数/模转换器)
Reflection mapping(反射贴图)
render(着色或渲染)
RGBA(Red、Blue、Green + Alpha,红、蓝、绿 + Alpha通道)
RGSS(Rotated Grid Super-Sampling,旋转栅格超级采样)
RM(Retention Mechanism,保持机构)
S端子(Seperate)
S3(Sight、Sound、Speed,视频、音频、速度)
S3TC(S3 Texture Compress,S3纹理压缩,仅支持S3显卡)
S3TL(S3 Transformation & Lighting,S3多边形转换和光源处理)
Screen Buffer(屏幕缓冲)
SDTV(Standard Definition Television,标准清晰度电视)
SEM(spherical environment mapping,球形环境映射)
Shading,描影
Single Pass Multi-Texturing,单通道多纹理
SLI(Scanline Interleave,扫描线间插,3Dfx的双Voodoo 2配合技术)
Smart Filter(智能过滤)
soft shadows(柔和阴影)
soft reflections(柔和反射)
spot light(小型点光源)
SRA(Symmetric Rendering Architecture,对称渲染架构)
Stencil Buffers(模板缓冲)
Stream Processor(流线处理)
Super Sampling(超级采样)
SuperScaler Rendering,超标量渲染
TBFB(Tile Based Frame Buffer,碎片纹理帧缓存)
texel(T像素,纹理上的像素点)
Texture Fidelity(纹理真实性)
texture swapping(纹理交换)
T&L(Transform and Lighting,多边形转换与光源处理)
T-Buffer(T缓冲,3dfx Voodoo5的特效,包括全景反锯齿Full-scene Anti-Aliasing、动态模糊Motion Blur、焦点模糊Depth of Field Blur、柔和阴影Soft Shadows、柔和反射Soft Reflections)
TCA(Twin Cache Architecture,双缓存结构)
Transparency(透明状效果)
Transformation(三角形转换)
Trilinear Filtering(三线性过滤)
Texture Modes,材质模式
TMIPM: Trilinear MIP Mapping(三次线性MIP材质贴图)
UMA(Unified Memory Architecture,统一内存架构)
VA(Vernier Acuity,游动敏感)
Visualize Geometry Engine,可视化几何引擎
Vertex Lighting(顶点光源)
Vertical Interpolation(垂直调变)
VIP(Video Interface Port,视频接口)
ViRGE: Video and Rendering Graphics Engine(视频描写图形引擎)
Voxel(Volume pixels,立体像素,Novalogic的技术)
VQTC(Vector-Quantization Texture Compression,向量纹理压缩)
VSA(Voodoo Scalable Architecture,可升级Voodoo架构)
VSIS(Video Signal Standard,视频信号标准)
VTC(Volume Texture Compression,体积纹理压缩)
v-sync(同步刷新)
YAB NCTC(Narrow Channel Texture compression,狭窄通道纹理压缩)
Z Buffer(Z缓存)

5、音频
3DPA(3D Positional Audio,3D定位音频)
AAC(Advanced Audio Compression,高级音频压缩)
AC(Audio Codec,音频多媒体数字信号编解码器)
AC97(Audio Codec '97,多媒体数字信号解编码器1997年标准)
AMC(audio/modem codec,音频/调制解调器多媒体数字信号编解码器)
APX(All Position eXpansion全方位扩展)
Auxiliary Input(辅助输入接口)
CS(Channel Separation,声道分离)
DDMA(Distributed DMA,分布式DMA)
DDSS(Dolby Digital Surround Sound,杜比数字环绕声)
DLS(Downloadable Sounds Level,可下载音色)
DLS-2(Downloadable Sounds Level 2,第二代可下载音色)
DS3D(DirectSound 3D Streams)
DSD(Direct Stream Digital,直接数字信号流)
DSP(Digital Sound Field Processing,数字音场处理)
DSL(Down Loadable Sample,可下载的取样音色)
DTS(Digital Theater System,数字剧院系统)
EAX(Environmental Audio Extensions,环境音效扩展技术)
Extended Stereo(扩展式立体声)
FM(Frequency Modulation,频率调制)
FIR(finite impulse response,有限推进响应)
FPS(FourPointSurround,创新的四点环绕扬声器系统)
FR(Frequence Response,频率响应)
FSE(Frequency Shifter Effect,频率转换效果)
HRTF(Head Related Transfer Function,头部关联传输功能)
I3DL2(Interactive 3D Level 2,第二级交互式3D音效)
IID(Interaural Intensity Difference,两侧声音强度差别)
IIR(infinite impulse response,无限推进响应)
Interactive Around-Sound(交互式环绕声)
Interactive 3D Audio(交互式3D音效)
ITD(Interaural Time Difference,两侧声音时间延迟差别)
MC(modem codec,调制解调器多媒体数字信号编解码器)
MIDI(Musical Instrument Digital Interface,乐器数字接口)
NDA: non-DWORD-aligned ,非DWORD排列
Raw PCM: Raw Pulse Code Modulated(元脉码调制)
RMA: RealMedia Architecture(实媒体架构)
RTSP: Real Time Streaming Protocol(实时流协议)
SACD(Super Audio CD,超级音乐CD)
SDMI(Secure Digital Music Initiative,安全式数字音乐)
SNR(Signal to Noise Ratio,信噪比)
S/PDIF(Sony/Phillips Digital Interface,索尼/飞利普数字接口)
SPU(Sound Processor Unit,声音处理器)
SRC(Sampling Rate Convertor,采样率转换器,把48KHz转为MD适用的44.1KHz)
SRS: Sound Retrieval System(声音修复系统)
Surround Sound(环绕立体声)
Super Intelligent Sound ASIC(超级智能音频集成电路)
TAD(Telephone Answering Device,电话应答设备)
TDMA(Transparent DMA,透明DMA)
THD+N(Total Harmonic Distortion plus Noise,总谐波失真加噪音)
QEM(Qsound Environmental Modeling,Qsound环境建模扬声器组)
WG(Wave Guide,波导合成)
WT(Wave Table,波表合成)

6、RAM & ROM
ABP: Address Bit Permuting,地址位序列改变
ADT(Advanced DRAM Technology,先进DRAM技术联盟)
AL(Additive Latency,附加反应时间)
ALDC(Adaptive Lossless Data Compression,适应无损数据压缩)
ATC(Access Time from Clock,时钟存取时间)
BEDO(Burst Enhanced Data-Out RAM,突发型数据增强输出内存)
BLP(Bottom Leaded Package,底部导向封装)
BSRAM(Burst pipelined synchronous static RAM,突发式管道同步静态存储器)
CAS(Column Address Strobe,列地址控制器)
CCT(Clock Cycle Time,时钟周期)
CDRAM(Cache DRAM,附加缓存型DRAM)
CL(CAS Latency,CAS反应时间)
CPA(Close Page Autoprecharge,接近页自动预充电)
CTR(CAS to RAS,列地址到行地址延迟时间)
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